Welcome to visit official website of PRIS 2024

2024 6^th International Conference on Pattern Recognition and Intelligent Systems (PRIS 2024) is organized by Asia Pacific Institute of Science and Engineering(APISE), technically sponsored by Wuhan University, supported by The Chinese University of Hong Kong, Jiangnan University, will be held in The Chinese University of Hong Kong, Hong Kong, S.A.R, China from July 25-27, 2024.

This conference is aimed at providing a platform for all researchers and engineers to share ideas, highly developed skills and successful practices to others. The conference will last for 3 days with the reception to be held on the first day to meet and mingle with conference chairs, session chairs and other participants.

We would like to invite you to join us in this important event and share your recent advance development and research finding in Pattern Recognition and Intelligent Systems to all attendees. Besides, it is also a good opportunity for you and your family to enjoy the culture and view in Hong Kong. We are looking forward to seeing you in PRIS 2024.

第六届模式识别与智能系统国际会议(PRIS 2024)由亚太科学与工程研究所(APISE)主办，武汉大学协办，香港中文大学及江南大学提供支持，将于2024年7月25日至27日在香港中文大学举办。

我们诚邀世界各地的专家、学者加入我们， 一起探讨交流模式识别与智能工程领域的最近研究发展， 推动智能领域的进一步发展， PRIS 2024会议期待您的加入！

CFP flyer downloading link

Speakers | 报告嘉宾

		Keep updating……
Prof. Ruxu Du	Prof. Hujun Yin
The Zhongke Jianchi Biotechnology Co., Ltd, China	The University of Manchester, UK

Organized and sponsored by | 主办及协办单位

Supported by | 支持单位

 

Publication & Indexing Information 出版及检索信息 

1, All the registered and presented papers will be included in the volume of ACM International Conference Proceedings Series (ISBN: 979-8-4007-1825-0). The publisher will submit articles to EI Compendex, Scopus, Web of Science and other databases for review and indexing after publication.

会议收录的文章将出版在ACM International Conference Proceedings Series (ISBN: 979-8-4007-1825-0)中, 该论文集由出版社在出版后提交给EI Compendex、Scopus、Web of Science等数据库进行评审和检索。*部分优秀文章还将推荐出版国际期刊。

PRIS 2023 - (ISBN: 978-1-4503-9996-8) | ACM ICPS | Ei Compendex and Scopus PRIS 2022 - (ISBN: 978-1-4503-9608-0) | ACM ICPS | Ei Compendex and Scopus PRIS 2021 - (ISBN: 978-1-4503-9039-2) | ACM ICPS | Ei Compendex and Scopus PRIS 2020 - (ISBN: 978-1-4503-8769-9) | ACM ICPS | Ei Compendex and Scopus …………

 

Peer Review Instructions & Submission/同行评审及投稿方式 

All the papers will be peer reviewed, and each paper will be peer reviewed by 2-3 experts. If the paper needs revising, it should be resubmited for peer review again. Submitted papers are evaluated using a double-blind review process for originality, relevance, and presentation. Reviewers for a paper will be kept anonymous.

1) Manuscripts must be written in English;
2) The manuscript should be written in accordance with the standard of template;
3) The topics of paper should be relevant to conference topics;
4) Plagiarism and Duplicate submission are prohibited;
5) Innovation and scientific value is a must.

Authors can submit their manuscripts in PDF through electronic submission system or email. In order to avoid repeated submission, please just choose one submisson method. Please click following link:

Electronic Submission System: https://cmt3.research.microsoft.com/PRIS2024
E-mail: pris@apise.org

For any inquiry about the conference, please feel free to contact us at: pris@apise.org.

作者可通过在线投稿系统或者会议邮箱提交文章（docx/pdf格式）， 为避免重复提交，请只选择一种方式提交。*注：仅全文投稿可出版，摘要投稿仅报告。

 

Important Dates/重要日期 

There are TWO rounds important dates. 共两轮投稿。

Round I	Round II
Full Paper Submission Deadline：	Full Paper Submission Deadline：
Jan. 30, 2024	Mar.30, 2024 Extended to May 30, 2024
Notification of Acceptance:	Notification of Acceptance:
Feb. 29, 2024	Apr.30, 2024 Extended to June 14, 2024
Registration Deadline:	Registration Deadline:
Mar.30, 2024	May 30, 2024 Extended to June 29, 2024

Program Preview/日程预览 

Program is subject to final confirmation. 日程安排以最终确认为准。

July 25, 2024 --	Registration and Conference Kits Collected
July 26, 2024 --	Opening Remark/Plenary Lecture/Panel Discussion/Special & Technical Session
July 27, 2024 --	Plenary Lecture/Panel Discussion/Industrial Forum/Industrial Visit